Apparatus and methods for tool mark free stitch bonding

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United States of America

PATENT NO 12142595
SERIAL NO

17557884

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Abstract

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Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.

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Patent Owner(s)

  • SKYWORKS SOLUTIONS, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Garing, Aldrin Quinones Mexicali, MX 8 9

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