Semiconductor device including a gate-all-around field effect transistor

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United States of America

PATENT NO 12142529
APP PUB NO 20230411215A1
SERIAL NO

18227779

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Abstract

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A method of manufacturing a semiconductor device includes forming a first semiconductor layer having a first composition over a semiconductor substrate, and forming a second semiconductor layer having a second composition over the first semiconductor layer. Another first semiconductor layer having the first composition is formed over the second semiconductor layer. A third semiconductor layer having a third composition is formed over the another first semiconductor layer. The first semiconductor layers, second semiconductor layer, and third semiconductor layer are patterned to form a fin structure. A portion of the third semiconductor layer is removed thereby forming a nanowire comprising the second semiconductor layer, and a conductive material is formed surrounding the nanowire. The first semiconductor layers, second semiconductor layer, and third semiconductor layer include different materials.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDNO 8 LI-HSIN RD 6 HSIN-CHU SCIENCE PARK HSIN-CHU 300-77

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Tung Ying Hsinchu, TW 151 2924
Yang, Fu-Hsiang Hsinchu, TW 8 50
Yu, Shao-Ming Zhubei, TW 96 1145
Yun, Wei-Sheng Hsinchu, TW 54 186

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