Wafer processing tools and methods thereof
Number of patents in Portfolio can not be more than 2000
United States of America
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Nov 12, 2024
Grant Date -
Nov 2, 2023
app pub date -
Jul 6, 2023
filing date -
Jul 6, 2023
priority date (Note) -
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Abstract
A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.
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