Substrate processing system and temperature control method

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12142501
APP PUB NO 20220013387A1
SERIAL NO

17484914

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Abstract

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A substrate processing system includes a substrate processing apparatus and a control device. The substrate processing apparatus includes a chamber, and a placing table provided inside the chamber. The placing table places a substrate thereon, and includes a base and an electrostatic chuck provided on an upper surface of the base. The electrostatic chuck has a plurality of division regions each provided with a heater therein. The substrate processing system also includes a control device that includes a measuring unit that measures a resistance value of the heater for each of the division regions, an estimating unit that estimates a temperature of each of the division regions based on the resistance value of the heater measured by the measuring unit, and a power controller that controls a power supplied to the heater for each of the division regions based on the temperature estimated by the estimating unit.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakamura, Kenichiro Miyagi, JP 66 963
Teruuchi, Satoru Miyagi, JP 9 31
Yamada, Kenichiro Miyagi, JP 139 3463
Yamamoto, Takari Miyagi, JP 13 43

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