Cu—Ni—Si-based copper alloy sheet material, method for producing same, and current-carrying component
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United States of America
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Nov 5, 2024
Grant Date -
Jan 19, 2023
app pub date -
Dec 23, 2020
filing date -
Dec 23, 2020
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Abstract
A copper alloy sheet material having improved etching characteristics contains (in mass %) Ni: 1.00 to 4.50%, Si: 0.10 to 1.40%, and optionally one or more kind of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn, and Ag. The sheet material has an area ratio SB/Ss of 0.40 or more in an EBSD measurement on a cross section perpendicular to a rolling direction, wherein Ss represents area of a region satisfying at least one of conditions of a crystal orientation difference from the S1 {241} <112>orientation of 10° or less or a crystal orientation difference from the S2 {231}<124>orientation of 10° or less, and SB represents an area of a region having a crystal orientation difference from the Brass {011}<211>orientation of 10° or less.
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