Method and device for adhesively bonding substrates in film form and composite body obtained thereby

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12134257
APP PUB NO 20220063258A1
SERIAL NO

17368379

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Importance

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Abstract

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The present invention relates to a method for adhesively bonding substrates in film form, wherein one of the substrates has a thermoplastic surface which is converted into a softened state prior to adhesive bonding, and wherein the surface of this substrate that is opposite to the thermoplastic surface is cooled using a cooling roller. Furthermore, the present invention relates to a device for carrying out the method according to the invention.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAADUSSELDORF DUESSELDORF NORTH RHINE-WESTPHALIA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gierlings, Michael Kaarst, DE 5 11
Kinzelmann, Hans-Georg Pulheim, DE 41 130

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