Heat-activated pump with integrated evaporator for electronic chip heat removal
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United States of America
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Oct 29, 2024
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N/A
app pub date -
Jun 15, 2023
filing date -
Jun 15, 2023
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Abstract
A heat-activated pump removes waste heat from an electronic chip. An evaporator integrated into the chip packaging receives heat from the chip, converting a working fluid into vapor. Piping from the evaporator to a heat exchanger and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared heat exchanger(s). The heat exchanger(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.
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