Optoelectronic component with a transparent bond between two joining partners and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12132158
APP PUB NO 20220077369A1
SERIAL NO

17432429

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Abstract

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In an embodiment an optoelectronic component includes a first joining partner including an LED chip with a structured light-emitting surface and a compensation layer applied to the light-emitting surface, wherein the compensation layer has a surface facing away from the light-emitting surface and spaced apart from the light-emitting surface, and wherein the surface forms a first connecting surface, a second joining partner having a second connecting surface, the first and second connecting surfaces being arranged such that they face each other and a bonding layer made of a film of low-melting glass having a layer thickness of not more than 1 μm, wherein the bonding layer bonds the first and second connecting surfaces together, wherein the structure of the light-emitting surface is embedded in the compensation layer, and wherein the first and second connecting surfaces are smooth such that their surface roughness, expressed as center-line roughness, is less than or equal to 50 nm.

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Patent Owner(s)

Patent OwnerAddress
OSRAM OPTO SEMICONDUCTORS GMBHREGENSBURG GERMANY REGENSBURG BAVARIA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eberhardt, Angela Augsburg, DE 40 159
Huettmayer, Thomas Diedorf, DE 2 1
Peskoller, Florian Ingolstadt, DE 18 41
Scheicher, Richard Thierhaupten, DE 6 16
Tangring, Ivar Regensburg, DE 38 17

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