Systems and methods for improved metrology for semiconductor device wafers

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United States of America

PATENT NO 12131959
APP PUB NO 20220344218A1
SERIAL NO

17469280

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Abstract

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A system and method for generating a quality parameter value of a semiconductor device wafer (SDW), during fabrication thereof, the method including designating a plurality of measurement site sets (MSSs) on the SDW, each of the MSSs including a first measurement-orientation site (FMS) and a second measurement-orientation site (SMS), the FMS and the SMS being different measurement sites on the SDW, generating a first measurement-orientation quality parameter dataset (FMQPD) by measuring features formed within each the FMS of at least one of the MSSs in a first measurement orientation, generating a second measurement-orientation quality parameter dataset (SMQPD) by measuring features formed within each the SMS of the at least one of the MSSs in a second measurement orientation and generating at least one tool-induced-shift (TIS)-ameliorated quality parameter value (TAQPV), at least partially based on the FMQPD and the SMQPD.

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Patent Owner(s)

Patent OwnerAddress
KLA CORPORATIONONE TECHNOLOGY DRIVE MILPITAS CA 95035

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bachar, Ohad Timrat, IL 30 461
Ben, David Nir Hod Hasharon, IL 2 1
Lavert, Etay Givat Ella, IL 7 6
Manassen, Amnon Haifa, IL 128 1032
Negri, Daria Haifa, IL 36 316
Simon, Yossi Qiryat Atta, IL 11 15
Uziel, Yoram Yodfat, IL 52 602
Yerushalmi, Liran Zicron Yaacob, IL 26 82

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