Device and method for bonding of substrates

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12131907
APP PUB NO 20190019678A1
SERIAL NO

16080156

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Abstract

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A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.

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Patent Owner(s)

  • EV GROUP E. THALLNER GMBH

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Plach, Thomas Stadl-Paura, AT 37 106
Suss, Jurgen Markus Rainbach, AT 18 36
Wagenleitner, Thomas Aurolzmunster, AT 51 647

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