Operating method of etching device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12131892
APP PUB NO 20220102120A1
SERIAL NO

17643405

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Importance

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Abstract

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A method includes the following steps. A wafer is disposed on a wafer-mounting surface of a wafer holder that is disposed in a chamber. The wafer-mounting surface is in parallel with a gravity direction. A gas is flown from a gas source to vacuum sealing device. An inductive coil wrapping around a vacuum sealing device excites the gas into plasma. The plasma is injected to the wafer.

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Patent Owner(s)

Patent OwnerAddress
NANYA TECHNOLOGY CORPORATIONNO 98 NANLIN RD TAISHAN DIST NEW TAIPEI CITY 243

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doong, Shyue-Ru Taipei, TW 10 3
Tsai, Feng-Ju Hsinchu County, TW 10 3

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