Leaf spring for an integrated circuit heat sink
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United States of America
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Oct 29, 2024
Grant Date -
Jan 18, 2024
app pub date -
Apr 20, 2021
filing date -
Apr 20, 2021
priority date (Note) -
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Abstract
Various embodiments of the present disclosure relate to a leaf spring for coupling a heat sink to an integrated circuit, where the leaf spring includes a central portion that has an aperture, a first spring arm that is formed on a first side of the central portion and includes a first through-hole for a first fastener, and a second spring arm that is formed on a second side of the central portion and includes a second through-hole for a second fastener. In various embodiments, a first bending axis passes through the first side and is substantially perpendicular to a longitudinal axis of the leaf spring that passes through the first through-hole and the second through-hole, and a second bending axis passes through the second side and is substantially perpendicular to the longitudinal axis of the leaf spring.
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