Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12128494
APP PUB NO 20230278123A1
SERIAL NO

18317571

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Abstract

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A method for the joining of ceramic pieces includes applying a layer of titanium on a first ceramic piece and applying a layer of titanium on a second ceramic piece; applying a layer of nickel on each of the layers of titanium on the first ceramic piece and the second ceramic piece; applying a layer of nickel phosphorous to each of the layers of nickel on the first ceramic piece and the second ceramic piece; assembling the first ceramic piece and the second ceramic piece with the layers of titanium, nickel, and nickel phosphorous therebetween; pressing the layer of nickel phosphorous of the first ceramic piece against the layer of nickel phosphorous of the second ceramic piece; heating the first ceramic piece and the second ceramic piece to a joining temperature in a vacuum; and cooling the first ceramic piece and the second ceramic piece. A hermetic seal is formed between the first ceramic piece and the second ceramic piece.

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Patent Owner(s)

Patent OwnerAddress
WATLOW ELECTRIC MANUFACTURING COMPANY12001 LACKLAND ROAD ST LOUIS MO 63146

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Elliot, Alfred Grant Palo Alto, US 26 554
Elliot, Brent Cupertino, US 26 151
Hussen, Guleid San Francisco, US 20 89
Parker, Michael Brentwood, US 97 1332
Stephens, Jason San Francisco, US 22 71

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