Semiconductor structure and semiconductor structure manufacturing method

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United States of America Patent

PATENT NO 12127395
SERIAL NO

17651108

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Abstract

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Embodiments of the present application provide a semiconductor structure and a semiconductor structure manufacturing method. The semiconductor structure includes: a wordline; and a first bitline and a second bitline located on two sides of the wordline and a first memory structure and a second memory structure located on the two sides of the wordline. The first bitline and the second bitline are connected to the first memory structure and the second memory structure respectively through a transistor. An extension direction of the first bitline is perpendicular to an extension direction of the wordline.

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Patent Owner(s)

Patent OwnerAddress
CHANGXIN MEMORY TECHNOLOGIES INCNO 388 XINGYE AVENUE AIRPORT INDUSTRIAL PARK ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA HEFEI ANHUI 230601

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liao, Chuxian Hefei, CN 5 4
Ying, Zhan Hefei, CN 72 63
Zhu, Yuhan Hefei, CN 13 23

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