Compression mounted technology (CMT) socket retention mechanisms to board or interposer

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United States of America Patent

PATENT NO 12127363
SERIAL NO

17033401

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Abstract

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Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

International Classification(s)

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  • 2020 Application Filing Year
  • H01R Class
  • 3472 Applications Filed
  • 2683 Patents Issued To-Date
  • 77.28 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boyd, Thomas Vancouver, US 88 453
Cheng, Feifei Chandler, US 11 14
Klein, Steven A Chandler, US 22 115
Liu, Kuang Queen Creek, US 16 23
Neumann, Daniel Newberg, US 20 83
Prabhugoud, Mohanraj Beaverton, US 28 78

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges500343601 - 1002505007501000125015001750200022502500275030003250350037504000425045004750500052505500

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