Method for transferring micro device on curved surface and apparatus for transferring micro device on curved surface

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United States of America Patent

PATENT NO 12127349
APP PUB NO 20210235588A1
SERIAL NO

15733942

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Abstract

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A method for transferring a micro device on a curved surface according to an exemplary embodiment of the present invention includes: coating an adhesive layer on an external circumferential surface of a tube; providing a micro device pattern on one side of a substrate; positioning an external circumferential surface of the tube to contact the substrate and allow a length direction of the device pattern to cross a radius direction of the tube, and rotating the tube with respect to an axis-direction of the tube and simultaneously moving at least one of the tube and the substrate in a rectilinear way to transfer the micro device pattern on the substrate to the adhesive layer; and fixing the transferred micro device pattern to the adhesive layer by curing the adhesive layer.

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Patent Owner(s)

Patent OwnerAddress
KOREA INSTITUTE OF MACHINERY & MATERIALS156 GAJEONGBUK-RO YUSEONG-GU DAEJEON 34103
CENTER FOR ADVANCED META-MATERIALS156 GAJEONGBUK-RO YUSEONG-GU DAEJEON 34103

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jang, Bongkyun Daejeon, KR 11 6
Jung, Hyun June Daejeon, KR 10 3
Kim, Jae-Hyun Daejeon, KR 351 2242
Kim, Kyung-Sik Daejeon, KR 19 159
Lee, Hak Joo Daejeon, KR 57 1121
Lee, Seung-Mo Pohang, KR 10 39

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