Low temperature co-fireable dielectric materials
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United States of America Patent
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Oct 22, 2024
Grant Date -
N/A
app pub date -
Jun 23, 2023
filing date -
Sep 8, 2017
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Abstract
Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SKYWORKS SOLUTIONS INC | IRVINE CA |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Coats, Neil Bruce | Walkersville, US | 5 | 34 |
Cruickshank, David Bowie | Rockville, US | 55 | 470 |
Firor, David Martin | Thurmont, US | 16 | 95 |
Hill, Michael David | Emmitsburg, US | 119 | 681 |
Jiang, Jianzhong | Leesburg, US | 6 | 27 |
Shunkwiler, Jeffrey Alan | Adamstown, US | 15 | 80 |
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