Optical multi-die interconnect bridge with optical interface

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United States of America Patent

PATENT NO 12124095
APP PUB NO 20230418010A1
SERIAL NO

18243474

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Abstract

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A package includes a bridging element (an OMIB), and first and second photonic paths, forming a bidirectional photonic path. The OMIB has first and second interconnect regions to connect with one or more dies. Third and fourth unidirectional photonic paths may couple between the first interconnect region and an optical interface (OI). A photonic transceiver has a first portion in the OMIB and a second portion in one of the dies. The first and the second portions may be coupled via an electrical interconnect less than 2 mm in length. The die includes compute elements around a central region, proximate to the second portion. The OMIB may include an electro-absorption modulator fabricated with germanium, silicon, an alloy of germanium, an alloy of silicon, a III-V material based on indium phosphide (InP), or a III-V material based on gallium arsenide (GaAs). The OMIB may include a temperature compensation for the modulator.

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Patent Owner(s)

  • CELESTIAL AI INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aggarwal, Ankur Pleasanton, US 37 318
Bos, Martinus San Jose, US 23 104
Lazovsky, David Los Gatos, US 16 89
Sahni, Subal La Jolla, US 58 321
Winterbottom, Philip San Jose, US 32 128

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