Microelectronics H-frame device

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United States of America Patent

PATENT NO 12122666
APP PUB NO 20220289559A1
SERIAL NO

17198700

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Abstract

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A microelectronics H-frame device includes: a stack of two or more substrates wherein the substrate stack comprises a top substrate and a bottom substrate, wherein bonding of the top substrate to the bottom substrate creates a vertical electrical connection between the top substrate and the bottom substrate, wherein the top surface of the top substrate comprises top substrate top metallization, wherein the bottom surface of the bottom substrate comprises bottom substrate bottom metallization; mid-substrate metallization located between the top substrate and the bottom substrate; a micro-machined top cover bonded to a top side of the substrate stack; and a micro-machined bottom cover bonded to a bottom side of the substrate stack.

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Patent Owner(s)

Patent OwnerAddress
NORTHROP GRUMMAN SYSTEMS CORPORATION2980 FAIRVIEW PARK DRIVE FALLS CHURCH VA 22042-4511

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Duan, Dah-Weih Torrance, US 46 3950
Kunkee, Elizabeth T Manhattan Beach, US 34 109
Roden, Martin E Long Beach, US 4 1
Woo, Laura M Rossmoor, US 3 1

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