Antimicrobial products containing silver and copper particles
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United States of America Patent
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Oct 22, 2024
Grant Date -
Mar 30, 2023
app pub date -
Dec 31, 2021
filing date -
Sep 30, 2021
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Abstract
This invention relates to an antimicrobial product containing silver-copper particles and its preparation method. The product includes a substrate and positively charged silver particles with a particle size of 15 μm to 50 μm, and a positively charged copper particle with a particle size of 10 μm to 50 μm, wherein the copper particle size ratio to the silver particle is 0.8 to 1.2. The silver particle, the copper particle and the substrate are combined by means of semi-fused sintering, wherein the ratio of the silver particle to the copper particle is 40:60 to 95:5. The sum of the substrate, the silver particles and the total particles of the copper particles is less than or equal to 10%.
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