Method for producing package substrate for mounting semiconductor device

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United States of America Patent

PATENT NO 12119277
SERIAL NO

17413277

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Abstract

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A method for producing a package substrate for mounting a semiconductor device includes:

    forming a first substrate by forming a laminate in which a first metal layer that has a thickness of 1 μm to 70 μm and that is peelable from a core resin layer, a first insulating resin layer, and a second metal layer are arranged on both sides of the core resin layer having a thickness of 1 μm to 80 μm, and heating and pressurizing the laminate simultaneously;forming a pattern on the second metal layer;forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer on a surface of the second metal layer; andpeeling, from the core resin layer, a third substrate including the first metal and insulating resin layers, the second metal and insulating layers, and the third metal layer.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI GAS CHEMICAL COMPANY INC5-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 1008324 ?1008324

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirano, Syunsuke Yamagata, JP 11 13
Kato, Yoshihiro Fukushima, JP 117 1262
Ogashiwa, Takaaki Yamagata, JP 32 83

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