Device and method for measuring characteristics of a wafer

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United States of America Patent

PATENT NO 12117489
SERIAL NO

17019239

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Abstract

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A device for measuring characteristics of a wafer is provided. The device includes a first circuit on the wafer and having a first number of parallelly connected oscillators, and a second circuit on the wafer and having the first number of parallelly connected oscillators; wherein a first portion of the second circuit is disconnected from a second portion of the second circuit.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chih-Chiang Taipei, TW 251 1515
Chen, Yung-Shun Hsinchu, TW 60 436
Hsieh, Chung-Peng New Taipei, TW 33 104
Peng, Yung-Chow Hsinchu, TW 205 737

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