Method of bonding substrates and separating a portion of the bonded substrates through the bond, such as to manufacture an array of liquid lenses and separate the array into individual liquid lenses
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United States of America Patent
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Oct 15, 2024
Grant Date -
Sep 15, 2022
app pub date -
Aug 11, 2020
filing date -
Aug 15, 2019
priority date (Note) -
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Abstract
A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.
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