Surface mount technology method and magnetic carrier system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12114435
APP PUB NO 20230371185A1
SERIAL NO

17744291

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

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Patent Owner(s)

Patent OwnerAddress
SANDISK TECHNOLOGIES INC951 SANDISK DRIVE LEGAL DEP MILPITAS CA 95035

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jingyun Shanghai, CN 7 17
Chen, Lian Shanghai, CN 16 75
He, Enoch Shanghai, CN 1 0
Jiang, Vincent Shanghai, CN 3 1
Li, Guangqiang Shanghai, CN 3 0
Liu, Yonglong Shanghai, CN 2 0
Qu, Paul Shanghai, CN 5 3
Zhang, Yuanheng Shanghai, CN 3 9
Zhu, Shixing Shanghai, CN 4 2
Zhu, Virgil Shanghai, CN 1 0

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