Substrate, method for manufacturing substrate, and electronic device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Oct 8, 2024
Grant Date -
Sep 29, 2022
app pub date -
May 26, 2020
filing date -
May 26, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
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US Family Size
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Non-US Coverage
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Abstract
A substrate that enables increasing an allowable current value of a current path in a thickness direction of the substrate and narrowing spaces between multiple current paths, and the like are provided. To solve this subject, a substrate includes a sheet-shaped first base material (1) having a penetrating hole (1B) in the thickness direction and includes a second base material (2) fitted into the penetrating hole (1B). The second base material (2) includes multiple metal bodies (2B). The metal bodies (2B) penetrate in the thickness direction of the first base material (1) in a state of having an end exposed at each of a first surface and a second surface of the second base material (2) that face each other in the thickness direction.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| JP | A | JP2021040021 | Sep 03, 2019 |
| KR | A | KR20220057528 | May 26, 2020 |
| CN | A | CN114271035 | May 26, 2020 |
| WO | A1 | WO2021044675 | May 26, 2020 |
| TW | A | TW202126127 | Jun 03, 2020 |
International Classification(s)
- 2020 Application Filing Year
- H01L Class
- 29783 Applications Filed
- 21134 Patents Issued To-Date
- 70.96 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Apr 8, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 8, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 8, 2036 |
