System and apparatus for sequential transient liquid phase bonding
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United States of America Patent
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Oct 8, 2024
Grant Date -
Oct 12, 2023
app pub date -
Jun 16, 2023
filing date -
Oct 15, 2021
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Abstract
Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
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