System and apparatus for sequential transient liquid phase bonding
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United States of America Patent
Stats
-
Oct 8, 2024
Grant Date -
Oct 12, 2023
app pub date -
Jun 16, 2023
filing date -
Oct 15, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
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International Classification(s)
- 2023 Application Filing Year
- B23K Class
- 1289 Applications Filed
- 271 Patents Issued To-Date
- 21.03 % Issued To-Date
Cited Art Landscape
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- 0 Citation Count
- B23K Class
- 0 % this patent is cited more than
- 1 Age
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