Wafer placement table
Number of patents in Portfolio can not be more than 2000
United States of America
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-
Oct 1, 2024
Grant Date -
N/A
app pub date -
Jul 1, 2021
filing date -
Jul 1, 2021
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A wafer placement table includes a ceramic plate, an electrode embedded in the ceramic plate, a hollow ceramic shaft attached to a surface of the ceramic plate, a power-supplying member running inside the ceramic shaft and connected to a terminal of the electrode, a plate-side attaching site defined on the ceramic plate and to which the power-supplying member is attached, and a power-source-side attaching site defined at a free end of the ceramic shaft and to which the power-supplying member is attached. The power-source-side attaching site is defined in correspondence with the plate-side attaching site and in such a manner as to be shifted from the plate-side attaching site in plan view. The power-supplying member includes a redirecting portion where the power-supplying member extending from the power-source-side attaching site is forcibly redirected toward the plate-side attaching site.
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