Vertical cavity surface emitting laser (VCSEL) array package and manufacturing method
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United States of America
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Oct 1, 2024
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N/A
app pub date -
Aug 22, 2018
filing date -
Aug 22, 2018
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Abstract
A Vertical Cavity Surface Emitting Laser (VCSEL) array package includes a VCSEL array chip bonded on a substrate, a support structure surrounding the VCSEL array chip, and an optical component mounted on the support structure. The support structure is molded directly on the substrate using a high thermal conductivity molding material. The support structure covers all side surfaces of the VCSEL array chip to facilitate heat transfer through the chip's sides. A transparent layer is deposited on the output surface of the VCSEL array chip, which prevents the support structure from blocking an output beam during molding.
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