Method of bonding substrates, microchip and method of manufacturing the same
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United States of America Patent
Stats
-
Oct 1, 2024
Grant Date -
May 24, 2018
app pub date -
Nov 15, 2017
filing date -
Nov 21, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.
First Claim
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Family
International Classification(s)
- 2017 Application Filing Year
- C09J Class
- 1394 Applications Filed
- 852 Patents Issued To-Date
- 61.12 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C09J Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Apr 1, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 1, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 1, 2036 |
