Shield printed wiring board with ground member and ground member

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12101872
APP PUB NO 20230371168A1
SERIAL NO

18044436

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided. A shielded printed wiring board with a ground member of the present invention is a shielded printed wiring board with a ground member, including: a substrate film formed by sequentially stacking a base film, a printed circuit including a ground circuit, and an insulating film; a shielding film including a shielding layer and a protective layer laminated on the shielding layer, the shielding film covering the substrate film such that the shielding layer is closer to the substrate film than the protective layer is; and a ground member arranged on the protective layer of the shielding film, the ground member including an external connection member having a first main surface and a second main surface opposite to the first main surface, and having electroconductivity, electroconductive particles disposed on the first main surface side, and an adhesive resin for fixing the electroconductive particles to the first main surface, wherein circularity of the cross sections of the electroconductive particles in the cross section of the ground member is 0.35 or more, and the electroconductive particles are penetrating the protective layer of the shielding film and connected to the shielding layer of the shielding film, and the external connection member of the ground member is electrically connectable to an external ground.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TATSUTA ELECTRIC WIRE & CABLE CO LTDJAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haruna, Yuusuke Kizugawa, JP 16 9

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Maintenance Fees

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