Active matrix substrate and method for manufacturing same
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United States of America
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Sep 24, 2024
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N/A
app pub date -
Nov 29, 2021
filing date -
Nov 29, 2021
priority date (Note) -
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Abstract
An active matrix substrate includes a plurality of oxide semiconductor TFTs, and a plurality of wiring line connection sections, each of the plurality of wiring line connection sections includes a first connection electrode, an interlayer insulating layer extending over the first connection electrode, a wiring line contact hole formed in an insulating layer including the interlayer insulating layer, the wiring line contact hole exposing a part of a metal oxide layer of a first connection electrode, and a second connection electrode, and the second connection electrode is connected to a part of the metal oxide layer of the first connection electrode in the wiring line contact hole.
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