Power-forwarding bridge for inter-chip data signal transfer
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United States of America
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Sep 24, 2024
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N/A
app pub date -
Dec 18, 2020
filing date -
Dec 18, 2020
priority date (Note) -
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Abstract
An integrated circuit (IC) package, comprising a substrate that comprises a bridge die embedded within a dielectric. A first die comprising a first input/output (I/O) transmitter and a second die comprising a second I/O receiver and electrically coupled to the bridge die. A first signal trace and a first power conductor are within the bridge die. The first signal trace and the first power conductor are electrically coupled to the first I/O transmitter and the second I/O receiver. The first signal trace is to carry a digital signal and the first power conductor to provide a voltage for the second I/O receiver to read the digital signal.
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