Through-substrate laser patterning and isolating of thin conductive films
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United States of America Patent
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Sep 24, 2024
Grant Date -
Mar 11, 2021
app pub date -
Jan 16, 2019
filing date -
Jan 17, 2018
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Abstract
Embodiments of a composite structure are provided, the composite structure including: a substrate layer, a conductive layer and an overlayer. The conductive layer is disposed between the overlayer and the substrate layer. The substrate layer may comprise a material that is optically transparent over at least a part of the electromagnetic spectrum from 180 nm to 20 μm. The conductive layer includes a thickness of 10 nm or greater, a resistivity of 10 Ω-cm or less, and is an optically translucent or opaque over at least a part of the electromagnetic spectrum from 180 nm to 20 μm.
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