Method for manufacturing implantable electrodes and electrodes made by such methods

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United States of America Patent

PATENT NO 12098069
APP PUB NO 20230174372A1
SERIAL NO

17540750

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Abstract

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A method of manufacturing a plurality of neural probes from a silicon wafer in which after neural probes are formed on one side of a silicon wafer, the other side of the silicon wafter is subject to a dicing process that separates and adjusts the thickness of the neural probes.

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Patent Owner(s)

Patent OwnerAddress
KOO MINYOUNG3270 TIGER LILY DRIVE ANN ARBOR MI 48103

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Sangwoo Ann Arbor, US 125 649

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