Integrated circuit with radio frequency interconnect

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12095711
APP PUB NO 20230239129A1
SERIAL NO

18190881

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An integrated circuit includes first through fourth devices positioned over one or more substrates, a first radio frequency interconnect (RFI) including a first transmitter included in the first device, a first receiver included in the second device, and a first guided transmission medium coupled to each of the first transmitter and the first receiver, a second RFI including a second transmitter included in the first device, a second receiver included in the third device, and a second guided transmission medium coupled to each of the second transmitter and the second receiver, and a third RFI including a third transmitter included in the first device, a third receiver included in the fourth device, and the second guided transmission medium coupled to each of the third transmitter and the third receiver.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Huan-Neng Hsinchu, TW 161 745
Cho, Lan-Chou Hsinchu, TW 131 195
Huang, Tze-Chiang Saratoga, US 51 84
Jou, Chewn-Pu Hsinchu, TW 342 2019
Kuo, Feng Wei Hsinchu, TW 114 835
Lee, Yun-Han Hsinchu, TW 172 796
Liu, Jack Hsinchu, TW 127 918
Shen, William Wu Hsinchu, TW 66 550

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