Radio frequency module and communication device
Number of patents in Portfolio can not be more than 2000
United States of America
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Sep 17, 2024
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N/A
app pub date -
Feb 17, 2022
filing date -
Feb 17, 2022
priority date (Note) -
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Abstract
To provide a radio frequency module and a communication device capable of achieving reduction in height. The radio frequency module includes a mounting substrate and one or more chip inductors. The mounting substrate has a recess at least one end of both ends in a second direction orthogonal to a first direction that is a thickness direction of the mounting substrate. A second chip inductor that is at least one chip inductor of the one or more chip inductors is disposed in the recess.
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