Diffusion bonding heat exchanger
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United States of America
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Sep 17, 2024
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app pub date -
Nov 20, 2019
filing date -
Nov 20, 2019
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Abstract
An object of the present invention is to provide a diffusion bonding heat exchanger with which it is possible to reduce a thermal stress that is generated due to heat exchange between fluids significantly different from each other in temperature even in a case where the number of stacked heat transfer plates is made large. A diffusion bonding heat exchanger (100) includes a core (1) in which a plurality of heat transfer plates (HP) are stacked and diffusion-bonded to each other. The core includes a plurality of flow path blocks (40) each of which is configured to include a plurality of flow path layers (30) and a partition wall layer (50) that divides the plurality of flow path blocks. A thickness (t3) of the partition wall layer in a stacking direction is larger than an interval (t2) between flow paths arranged in the stacking direction.
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