Spherical silica powder
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United States of America
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Sep 17, 2024
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app pub date -
Jan 30, 2020
filing date -
Jan 30, 2020
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Abstract
A spherical silica powder with a low dielectric tangent, wherein after formulating the spherical silica powder in a resin and molding it into a sheet, in a dielectric tangent of the spherical silica powder calculated by using the following Formula (I) based on a dielectric tangent (tan δc) of the sheet which is measured under the conditions a frequency is 35-40 GHz with a resonator method, B/A is 0.70 or lower, wherein “A” represents a dielectric tangent (tan δfA) of the spherical silica powder before a dielectric tangent reduction treatment and “B” represents a dielectric tangent (tan δfB) of the spherical silica powder after a dielectric tangent reduction treatment; and a specific surface area of said spherical silica powder after a dielectric tangent reduction treatment is 1-30 m2/g.
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