Low-density structured materials and methods of making and using same
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United States of America Patent
Stats
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Sep 17, 2024
Grant Date -
May 11, 2023
app pub date -
Apr 21, 2021
filing date -
Apr 22, 2020
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A low-density structured material with good mechanical stability that can be used for three-dimensional structures, and methods to make and use same. In embodiments, the low-density structured material includes a first surface of interconnected polyhedrons, a plurality of tetrahedral arrangements whose base is the polyhedrons of the first surface, a second surface that is a web attached to the tetrahedral vertices of the tetrahedral arrangements, and panel materials overlying the web. The low-density structured material can be utilized in a variety of different structures.
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International Classification(s)
- 2021 Application Filing Year
- F17C Class
- 442 Applications Filed
- 190 Patents Issued To-Date
- 42.99 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- F17C Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Mar 17, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 17, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 17, 2036 |
