Laser reflow method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 17, 2024
Grant Date -
Sep 7, 2023
app pub date -
Feb 28, 2023
filing date -
Mar 4, 2022
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A laser reflow method includes preparing a workpiece including a board and semiconductor chips each having one or more bumps formed on one surface thereof, the semiconductor chips being placed on the board with the bumps interposed therebetween. An inclination detection step captures an image of one semiconductor chip and detects an inclination of the semiconductor chip within the captured image. A laser beam irradiation step irradiates each semiconductor chip with a laser beam from another surface side opposite to the one surface to reflow the bumps formed within an irradiated range of the workpiece. A phase pattern displayed by a spatial light modulator is rotated in such a manner as to agree with the inclination of the detected semiconductor chip, to thereby rotate an irradiation range of the laser beam within an irradiated surface of the workpiece, before the semiconductor chips are irradiated with the laser beam.
First Claim
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International Classification(s)
- 2023 Application Filing Year
- B23K Class
- 1289 Applications Filed
- 271 Patents Issued To-Date
- 21.03 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B23K Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Mar 17, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 17, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 17, 2036 |
