Acoustic wave device, high-frequency front end circuit, and communication device

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United States of America Patent

PATENT NO 12088273
APP PUB NO 20180159497A1
SERIAL NO

15889312

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Abstract

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An acoustic wave device includes a high acoustic velocity support substrate defining and functioning as a high acoustic velocity member, a low acoustic velocity film, a piezoelectric film, and an IDT electrode that are laminated in this order. When a wavelength of an acoustic wave determined by an electrode finger cycle of the IDT electrode is represented by λ, a film thickness of the piezoelectric film is about 1.5λ or more and about 3.5λ or less. The acoustic velocity of a bulk wave propagating in the high acoustic velocity support substrate is higher than the acoustic velocity of an acoustic wave propagating in the piezoelectric film. The acoustic velocity of a bulk wave propagating in the low acoustic velocity film is lower than the acoustic velocity of an acoustic wave propagating in the piezoelectric film.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTD10-1 HIGASHIKOTARI 1-CHOME NAGAOKAKYO-SHI KYOTO 617-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujio, Kohei Nagaokakyo, JP 9 0
Iwamoto, Hideki Nagaokakyo, JP 78 478
Otsubo, Ryo Nagaokakyo, JP 5 48

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