High current contact device
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United States of America
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Sep 10, 2024
Grant Date -
N/A
app pub date -
Jun 18, 2021
filing date -
Jun 18, 2021
priority date (Note) -
In Force
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Abstract
A high current contact device for transmitting electric energy includes a contact housing, a first contact element arranged in the contact housing, the first contact element extends at least in portions along a mating axis, and a temperature measuring device having a circuit carrier with a first temperature sensor and a first heat conducting path. The first temperature sensor is arranged on the circuit carrier and the circuit carrier is arranged laterally adjacent to the first contact element. The first heat conducting path has a first heat conducting element that is elastic and heat conductive with a contact surface. The contact surface abuts against a first outer circumferential side of the first contact element. The first heat conducting element thermally couples the first contact element to the first temperature sensor. The first temperature sensor measures a temperature of the first contact element.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TE CONNECTIVITY GERMANY GMBH | AMPERESTRASSE 12-14 BENSHEIM 64625 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Giri, Sandeep | Speyer, DE | 13 | 1231 |
Heiss, Dominik | Bensheim, DE | 30 | 15 |
Kowarsch, Philipp | Bensheim, DE | 3 | 6 |
Meissner, Tobias | Bensheim, DE | 4 | 10 |
Mueller, Alexander | Speyer, DE | 121 | 570 |
Zabeck, Sebastian | Speyer, DE | 13 | 160 |
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