Wiring board

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United States of America Patent

PATENT NO 12087988
APP PUB NO 20210359386A1
SERIAL NO

17381681

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Abstract

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A wiring board including a dielectric line containing a resin (A), and a dielectric exterior covering the dielectric line and containing a resin (B). The dielectric exterior has a relative permittivity lower than a relative permittivity of the dielectric line at 6 GHz and 25° C.

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Patent Owner(s)

Patent OwnerAddress
DAIKIN INDUSTRIES LTDUMEDA CENTER BUILDING 4-12 NAKAZAKI-NISHI 2-CHOME KITA-KU OSAKA-SHI OSAKA 530-8323

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Tomohiro Osaka, JP 135 1824
Yamanaka, Taku Osaka, JP 93 218
Yoshimoto, Hiroyuki Osaka, JP 59 279

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