Solid-state imaging device and electronic apparatus

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United States of America Patent

PATENT NO 12087795
APP PUB NO 20220216246A1
SERIAL NO

17608962

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Abstract

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A solid-state imaging device is provided that includes a first substrate including at least a first electrode, a first modification layer, a first low-permittivity layer formed on the first modification layer, and a first joint surface where the first electrode and the first modification layer are exposed; and a second substrate including at least a second electrode, a second modification layer, a second low-permittivity layer formed on the second modification layer, and a second joint surface where the second electrode and the second modification layer are exposed. The first modification layer has higher hydrophilicity than the first low-permittivity layer. The second modification layer has higher hydrophilicity than the second low-permittivity layer. The first substrate and the second substrate form a laminate structure and are electrically connected by bonding the first joint surface and the second joint surface.

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Patent Owner(s)

Patent OwnerAddress
SONY SEMICONDUCTOR SOLUTIONS CORPORATIONATSUGI-SHI KANAGAWA 243-0014

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashiguchi, Hideto Kanagawa, JP 27 92

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