Method for producing glass wafers for packaging electronic devices, and electronic component produced according to the method
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United States of America Patent
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Sep 10, 2024
Grant Date -
Jul 29, 2021
app pub date -
Jan 28, 2021
filing date -
Jan 28, 2020
priority date (Note) -
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Abstract
A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.
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