Method and a system for characterising structures through a substrate
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United States of America Patent
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Sep 3, 2024
Grant Date -
Nov 23, 2023
app pub date -
May 17, 2023
filing date -
May 19, 2022
priority date (Note) -
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Abstract
A method for characterizing structures etched in a substrate, such as a wafer is disclosed. The method includes the following steps: illuminating the bottom of at least one structure with an illumination beam issued from a light source emitting light with a wavelength adapted to be transmitted through the substrate, acquiring, with an imaging device positioned on the bottom side of said substrate, at least one image of a bottom of the at least one structure through the substrate, and measuring at least one data, called lateral data, relating to a lateral dimension of the bottom of the at least one HAR structure from the at least one acquired image. A system implementing such a method is also disclosed.
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