Use of bonding resin
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 3, 2024
Grant Date -
Aug 18, 2022
app pub date -
May 13, 2020
filing date -
May 15, 2019
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of certain crosslinkers such as ethers, and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or wood products, such as engineered wood products, such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.
First Claim
Other Claims data not available
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International Classification(s)
- 2020 Application Filing Year
- C09J Class
- 1286 Applications Filed
- 497 Patents Issued To-Date
- 38.65 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C09J Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Mar 3, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 3, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 3, 2036 |
