Printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America
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Aug 27, 2024
Grant Date -
N/A
app pub date -
Dec 22, 2021
filing date -
Dec 22, 2021
priority date (Note) -
In Force
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Abstract
The present disclosure relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.
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