Semiconductor device and method of controlling warpage during LAB

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12074135
APP PUB NO 20230307414A1
SERIAL NO

18315991

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Importance

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Abstract

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A semiconductor device has a semiconductor die and a support tape disposed over a back surface of the semiconductor die opposite an active surface of the semiconductor die. A portion of the back surface of the semiconductor wafer is removed to reduce its thickness. The semiconductor die is part of a semiconductor wafer, and the wafer is singulated to provide the semiconductor die with the support tape disposed on the back surface of the semiconductor die. The support tape can be a polyimide tape. A dicing tape is disposed over the support tape. The semiconductor die is disposed over a substrate. A laser emission is projected onto the semiconductor die to bond the semiconductor die to the substrate. The support tape provides stress relief to avoid warpage of the semiconductor die during the laser emission. The support tape is removed from the back surface of the semiconductor die.

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Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC PTE LTD5 YISHUN STREET 23 SINGAPORE 768442

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Braganca,, Jr Wagno Alves Incheon, KR 8 3
Kim, KyungOe Incheon, KR 31 140

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