Semiconductor manufacturing equipment and semiconductor manufacturing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 27, 2024
Grant Date -
Aug 5, 2021
app pub date -
Apr 20, 2021
filing date -
Dec 21, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Semiconductor manufacturing equipment includes a thickness calculation function, the thickness calculation function including a measurement value acquisition unit configured to acquire a plurality of measurement values at different measurement positions of the wafer from a thickness measurement function configured to measure a thickness of the wafer, a histogram data creation unit configured to create histogram data based on the plurality of measurement values, and a grade group extraction unit configured to extract a grade group from the histogram data, the grade group including sequential grades having frequencies equal to or greater than a predetermined frequency, the thickness calculation function further including a representative value calculation unit configured to calculate a representative value of a thickness of a measurement region based on the grades included in the extracted grade group.
First Claim
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International Classification(s)
- 2021 Application Filing Year
- H01L Class
- 28775 Applications Filed
- 15216 Patents Issued To-Date
- 52.88 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 1 Age
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